digest of research findings from scientific papers

How much current and heat the surface mount device (SMD) packages can handle?

By |2020-09-11T16:37:21+08:00September 11th, 2020|about SiC, digest|

There is an impression that the capability of small form factor surface mount device (SMD) packages in handling current and heat is limited. This is not true, at least the limitation does not come from the package itself. For example, in an application note, Infineon shows that the continuous current rating of power MOSFET

“All you need is less”

By |2020-08-13T23:39:02+08:00August 13th, 2020|about SiC, applications, digest, ideas|

 Silicon carbide (SiC) Schottky rectifiers are extremely fast with zero minority carrier (hole) reverse recovery charge (Qrr). The only charge participated during the switching of SiC Schottky Rectifiers is the majority carrier (electron) junction capacitive charge (Qc). The Qc of SiC Schottky Rectifiers does not change with temperatures or operation conditions such as forward current

C-V curve matters for quiet power electronics

By |2020-07-30T15:09:49+08:00July 30th, 2020|about SiC, digest, ideas|

Key Takeaways: Abrupt change of Cgd causes uncontrolled high dV/dt during switching transients results in oscillations and generates EMI. Abrupt change of Cgd with Vds has adverse effect on EMI/EMC. Device with smoother C-V curve performs better. Abrupt change of capacitive ratio Cgd/Cgs with Vds also adversely impacts EMI/EMC, smoother is better. A paper published

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