How much current and heat the surface mount device (SMD) packages can handle?

By |2020-09-11T16:37:21+08:00September 11th, 2020|about SiC, digest|

There is an impression that the capability of small form factor surface mount device (SMD) packages in handling current and heat is limited. This is not true, at least the limitation does not come from the package itself. For example, in an application note, Infineon shows that the continuous current rating of power MOSFET